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Microscopic Sandblasting （MS Processing)

 

The trust of the microscopic sandblasting processing can be processed.

Minute hole processing and minute ditch processing are avairable.

Please feel free to call us of a small amount of processing.

Applicable material

Glass substrate (soda, borosilicic acid, Pyrex, and others)

ceramic substrate (alumina, silicon nitride, silicon carbide, and others)

Silicon wafer, carbon material and ferrite, metal, and PZT another

Processing example      

  3μmガラス溝加工図   20umガラス溝加工図 セラミックギア図

 
  glass channel processing on the glass （process width 30um) processing depth 40um glass channel processing (process width 20um) processing depth 10μm Ceramic Gear fabrication
（shape processing from board）		  
    金属溝加工図   セラミックピン立て図  
   silicon wafer dimple processing metal (sus)  channel processing depth 35um  ceramic pin setting up  
ガラス断面形状コントロール図  ガラス加工断面図 
　The processing section shape iscontrolled 　Processing section shape

(conventional type)

Processing equipments in our plant

Processing process
　　　Mask patterning equipment
 ラミネータ図 露光機図  スピンコータ図
One Laminator  Two exposure machines   One spin coater machine
 シャワー式現像機
高圧ミスト式現像機１		 高圧ミスト式現像機２  スクリーン製版機
One shower type developer machine Two high-pressure mist type developer machines One screen printer
Sandblast machine for micro fabrication
 サンドブラスト装置１

One large-scale blaster equipment

（950mm in the maximum process width)


Five medium blaster equipments

（450mm in the maximum process width)

One medium test equipment

（300mm in the maximum process width)


Three small test equipments

（150mm in the maximum process width)
 サンドブラスト装置２
   
 

Consultation of device and processing


TEL:052-758-1102　　FAX:052-758-1103
　

Please inquire of Here.